Along with the miniaturization and weight reduction of electronic equipment, the mounting density of the components is increasing. As a result, the heat dissipation performance is liable to fall, bringing about an increase in the temperature of the equipment. Particularly, the heat emitted from devices in a power output circuit has a major effect in raising the temperature of the equipment. Also, for applications, such as smoothing of the output from a switching power supply or coupling of the output of a high frequency power amplifier, in which a large current flows through a capacitor, the power consumption due to the loss component of the capacitor sometimes increases to the extent that self-heat generation cannot be ignored. For this reason, it is necessary to suppress the temperature rise of the capacitor to the range within which the reliability of the capacitor is not compromised.
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